Mercato del packaging IC 3D per tecnologia (3D tramite silicio, package 3D su package, basato su fan out 3D, wire bonded 3D), per materiale (substrato organico, filo di legame, leadframe, resina di incapsulamento, package ceramico, materiale di attacco matrice), per settore verticale (elettronica, i

Published on: 2025-02-05 | No of Pages : 340 | Industry : ICT

Publisher : MRA | Format : PDF

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Mercato del packaging IC 3D per tecnologia (3D tramite silicio, package 3D su package, basato su fan out 3D, wire bonded 3D), per materiale (substrato organico, filo di legame, leadframe, resina di incapsulamento, package ceramico, materiale di attacco matrice), per settore verticale (elettronica, i

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