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晶圆清洗设备市场规模按晶圆尺寸（≤ 150 毫米、200 毫米、300 毫米）、按技术（湿化学清洗工艺、蒸汽干清洗工艺、水清洗工艺、低温气溶胶超临界流体清洗工艺）、按设备（洗涤器、单晶圆喷雾系统、单晶圆低温系统、批量浸没清洗、批量喷雾清洗、超声波清洗设备）、按操作模式（自动、半自动、手动）、按应用（微机电系统 (MEMS)、CMOS 图像传感器 (CIS)、内存、逻辑、插入器、射频 (RF) 设备、发光二极管 (LED)）、按地理范围和预测划分

Published on: 2024-08-17 | No of Pages : 240 | Industry : latest trending Report

Publisher : MRA | Format : PDF&Excel

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