Marché des puces retournées – Par technologie d’emballage IC 3D, IC 2.5D, IC 2D , par technologie de Bumping pilier de cuivre, Bumping de soudure, Bumping d’or , par type d’emballage FC BGA, FC PGA, FC LGA, FC QFN, FC Sip, FC CSP , par utilisation finale et prévisions 2022-2034

Published on: 2024-07-05 | No of Pages : 432 | Industry : Dernières tendances

Publisher : MRAA | Format : PDF&Excel

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Marché des puces retournées – Par technologie d’emballage IC 3D, IC 2.5D, IC 2D , par technologie de Bumping pilier de cuivre, Bumping de soudure, Bumping d’or , par type d’emballage FC BGA, FC PGA, FC LGA, FC QFN, FC Sip, FC CSP , par utilisation finale et prévisions 2022-2034

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