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Mercado de empaquetado de circuitos integrados 3D por tecnología (3D a través de silicio, 3D en paquete sobre paquete, 3D basado en abanico, 3D unido por cable), por material (sustrato orgánico, cable de unión, marco conductor, resina de encapsulación, paquete cerámico, material de unión de matriz),

Published on: 2025-02-03 | No of Pages : 450 | Industry : ICT

Publisher : MRA | Format : PDF

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