Global Semiconductor & IC Packaging Market Insights, Forecast to 2034
Published on: 2024-01-04 | No of Pages : 400 | Industry : Packaging
Publisher : MRA | Format : PDF
Global Semiconductor & IC Packaging Market Insights, Forecast to 2034
Market Analysis and InsightsGlobal Semiconductor & IC Packaging Market
Global Semiconductor & IC Packaging market is expected to reach to US$ million in 2023, with a positive growth of %, compared with US$ million in 2022 which suffered dual impact of COVID-19 and Russia-Ukraine War in the year. Backed with the increasing demand from downstream industries, Semiconductor & IC Packaging industry is evaluated to reach US$ million in 2029. The CAGR will be % during 2023 to 2029.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Covers
This report presents an overview of global Semiconductor & IC Packaging market from 2018 to 2029, aiming to help readers to get a comprehensive understanding of global Semiconductor & IC Packaging market with multiple angles. Items like regional revenue from 2018 to 2029 and companies’ revenue and gross margin from 2018 to 2023 are analyzed. In addition, revenue of product type and application in each region from 2018 to 2029 are also highlighted.
Companies, Type, Application and Regions Listed in the Report
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ASE
Amkor
SPIL
STATS ChipPac
Powertech Technology
J-devices
UTAC
JECT
ChipMOS
Chipbond
KYEC
STS Semiconductor
Huatian
MPl(Carsem)
Nepes
FATC
Walton
Kyocera
Unisem
NantongFujitsu Microelectronics
Hana Micron
Walton Advanced Engineering
Signetics
Intel Corp
LINGSEN
Segment by Type
DIP
SOP
QFP
QFN
BGA
CSP
Others
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter 1Product definition, type and application introduction
Chapter 2Regional revenue analysis from 2018 to 2029
Chapter 3Detailed analysis of Product Name companies’ competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4Product revenue analysis by type from 2018 to 2029 globally
Chapter 5Product revenue analysis by application from 2018 to 2029 globally
Chapter 6Product revenue analysis by type and application from 2018 to 2029 in US & Canada. Product revenue analysis of each country in US & Canada from 2018 to 2029
Chapter 7Product revenue analysis by type and application from 2018 to 2029 in Europe. Product revenue analysis of each country in Europe from 2018 to 2029
Chapter 8Product revenue analysis by type and application from 2018 to 2029 in China. Product revenue analysis of China from 2018 to 2029
Chapter 9Product revenue analysis by type and application from 2018 to 2029 in Asia (excluding China). Product revenue analysis of each country in Asia (excluding China) from 2018 to 2029
Chapter 10Product revenue analysis by type and application from 2018 to 2029 in Middle East, Africa and Latin America. Product revenue analysis of each country in Middle East, Africa and Latin America from 2018 to 2029.
Chapter 11Companies’ outline, covering company’s basic information, major business, Semiconductor & IC Packaging introduction, etc. Semiconductor & IC Packaging Revenue and Gross Margin of each company from 2018 to 2023
Chapter 12MRAResearch’s Conclusions of Semiconductor & IC Packaging
Chapter 13Methodology and Data Sources adopted by MRAResearch
Global Semiconductor & IC Packaging market is expected to reach to US$ million in 2023, with a positive growth of %, compared with US$ million in 2022 which suffered dual impact of COVID-19 and Russia-Ukraine War in the year. Backed with the increasing demand from downstream industries, Semiconductor & IC Packaging industry is evaluated to reach US$ million in 2029. The CAGR will be % during 2023 to 2029.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Covers
This report presents an overview of global Semiconductor & IC Packaging market from 2018 to 2029, aiming to help readers to get a comprehensive understanding of global Semiconductor & IC Packaging market with multiple angles. Items like regional revenue from 2018 to 2029 and companies’ revenue and gross margin from 2018 to 2023 are analyzed. In addition, revenue of product type and application in each region from 2018 to 2029 are also highlighted.
Companies, Type, Application and Regions Listed in the Report
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By Company
ASE
Amkor
SPIL
STATS ChipPac
Powertech Technology
J-devices
UTAC
JECT
ChipMOS
Chipbond
KYEC
STS Semiconductor
Huatian
MPl(Carsem)
Nepes
FATC
Walton
Kyocera
Unisem
NantongFujitsu Microelectronics
Hana Micron
Walton Advanced Engineering
Signetics
Intel Corp
LINGSEN
Segment by Type
DIP
SOP
QFP
QFN
BGA
CSP
Others
Segment by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1Product definition, type and application introduction
Chapter 2Regional revenue analysis from 2018 to 2029
Chapter 3Detailed analysis of Product Name companies’ competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4Product revenue analysis by type from 2018 to 2029 globally
Chapter 5Product revenue analysis by application from 2018 to 2029 globally
Chapter 6Product revenue analysis by type and application from 2018 to 2029 in US & Canada. Product revenue analysis of each country in US & Canada from 2018 to 2029
Chapter 7Product revenue analysis by type and application from 2018 to 2029 in Europe. Product revenue analysis of each country in Europe from 2018 to 2029
Chapter 8Product revenue analysis by type and application from 2018 to 2029 in China. Product revenue analysis of China from 2018 to 2029
Chapter 9Product revenue analysis by type and application from 2018 to 2029 in Asia (excluding China). Product revenue analysis of each country in Asia (excluding China) from 2018 to 2029
Chapter 10Product revenue analysis by type and application from 2018 to 2029 in Middle East, Africa and Latin America. Product revenue analysis of each country in Middle East, Africa and Latin America from 2018 to 2029.
Chapter 11Companies’ outline, covering company’s basic information, major business, Semiconductor & IC Packaging introduction, etc. Semiconductor & IC Packaging Revenue and Gross Margin of each company from 2018 to 2023
Chapter 12MRAResearch’s Conclusions of Semiconductor & IC Packaging
Chapter 13Methodology and Data Sources adopted by MRAResearch
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