Global Metal Shell for Microelectronic Packages Sales Market Report 2024
Published on: 2024-01-04 | No of Pages : 400 | Industry : Packaging
Publisher : MRA | Format : PDF
Global Metal Shell for Microelectronic Packages Sales Market Report 2024
Market Analysis and InsightsGlobal Metal Shell for Microelectronic Packages Market
Metal is still the main material of electronic packaging because of its advantages such as good mechanical strength, good thermal conductivity, electromagnetic shielding function and convenient machining. Metal packaging refers to the metal as the main material of the tube shell, directly or indirectly through the substrate to install the chip on the tube seat, with a lead wire connected to the internal and external circuit of an electronic packaging form. It is widely used in the packaging of hybrid circuits, mainly for military, civil and customized special airtight packaging, among which, it has been widely used in the military and aerospace fields. The various forms of metal packaging and flexible processing can be integrated with some components (such as hybrid integrated A/D or D/A converters), suitable for low I/O single chip and multi-chip applications, RF, microwave, optoelectronic, surface acoustic wave and high power devices, can meet the requirements of small batch, high reliability. In addition, in order to solve the problem of packaging heat dissipation, all kinds of packaging also mostly use metal as heat sink and heat sink.
Traditional metal materials includeCu, Al, Kovar alloy (Fe-Ni-Co alloy), Invar alloy (Ni-Fe alloy), W, Mo alloy and so on.
Most metal packages are physical packages. Metal packaging materials in order to achieve the total piece support, electrical connection, heat dissipation, mechanical and environmental protection, usually have the following requirements; ① has good heat conduction and heat dissipation; ② good conductivity, reduce transmission delay and energy loss and sweep; (3) light weight, at the same time requires sufficient strength and mechanical properties; ④ Good processing capacity for mass production; (5) Low thermal expansion coefficient, in order to meet the match with the chip, thereby reducing the generation of thermal stress; Good welding performance, coating performance and corrosion resistance to achieve reliable combination with the chip, sealing and environmental protection.
Due to the COVID-19 pandemic, the global Metal Shell for Microelectronic Packages market size is estimated to be worth US$ 1994.2 million in 2022 and is forecast to a readjusted size of US$ 1980.1 million by 2029 with a CAGR of -0.1% during the forecast period 2023-2029. Fully considering the economic change by this health crisis, TO Shell accounting for % of the Metal Shell for Microelectronic Packages global market in 2022, is projected to value US$ million by 2029, growing at a revised % CAGR from 2023 to 2029. While Aeronautics and Astronautics segment is altered to an % CAGR throughout this forecast period.
In terms of market sales, China accounts for 22% of global market share.
In terms of suppliers, the world's leading manufacturers of metal packaging and shell include AMETEK(GSP), SCHOTT, Complete Hermetics, KOTO, Kyocera, SGA Technologies, Century Seals, Kairui, Jiangsu Dongcheng Micro-electronics, Taizhou Hangyu Electric Appliance, CETC40, Bojing Electronics, CETC43, SINOPIONEER, CCTC, Xingchuang, Rizhao Xunsun Electronics and Shengda Technology. The top five together account for 40% of the market.
In the consumer application market, the main application fields are concentrated in aerospace, petrochemical industry, automobile, optical communication and other fields. Among them, optical communication is the largest application field, with more than 31% of the metal shells used for packaging concentrated in optical communication.
Global Metal Shell for Microelectronic Packages Scope and Market Size
The global Metal Shell for Microelectronic Packages market is segmented by company, region (country), type and application. Players, stakeholders, and other participants in the global Metal Shell for Microelectronic Packages market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), type and application for the period 2018-2029.
Segment by Type
TO Shell
Flat Shell
Aeronautics and Astronautics
Petrochemical Industry
Automobile
Optical Communication
Other
By Region
United States
Europe
China
Japan
Southeast Asia
India
Other Regions
AMETEK(GSP)
SCHOTT
Complete Hermetics
KOTO
Kyocera
SGA Technologies
Century Seals
KaiRui
Jiangsu Dongguang Micro-electronics
Taizhou Hangyu Electric Appliance
CETC40
BOJING ELECTRONICS
CETC43
SINOPIONEER
CCTC
XingChuang
Rizhao Xuri Electronics Co., Ltd.
ShengDa Technology
Metal is still the main material of electronic packaging because of its advantages such as good mechanical strength, good thermal conductivity, electromagnetic shielding function and convenient machining. Metal packaging refers to the metal as the main material of the tube shell, directly or indirectly through the substrate to install the chip on the tube seat, with a lead wire connected to the internal and external circuit of an electronic packaging form. It is widely used in the packaging of hybrid circuits, mainly for military, civil and customized special airtight packaging, among which, it has been widely used in the military and aerospace fields. The various forms of metal packaging and flexible processing can be integrated with some components (such as hybrid integrated A/D or D/A converters), suitable for low I/O single chip and multi-chip applications, RF, microwave, optoelectronic, surface acoustic wave and high power devices, can meet the requirements of small batch, high reliability. In addition, in order to solve the problem of packaging heat dissipation, all kinds of packaging also mostly use metal as heat sink and heat sink.
Traditional metal materials includeCu, Al, Kovar alloy (Fe-Ni-Co alloy), Invar alloy (Ni-Fe alloy), W, Mo alloy and so on.
Most metal packages are physical packages. Metal packaging materials in order to achieve the total piece support, electrical connection, heat dissipation, mechanical and environmental protection, usually have the following requirements; ① has good heat conduction and heat dissipation; ② good conductivity, reduce transmission delay and energy loss and sweep; (3) light weight, at the same time requires sufficient strength and mechanical properties; ④ Good processing capacity for mass production; (5) Low thermal expansion coefficient, in order to meet the match with the chip, thereby reducing the generation of thermal stress; Good welding performance, coating performance and corrosion resistance to achieve reliable combination with the chip, sealing and environmental protection.
Due to the COVID-19 pandemic, the global Metal Shell for Microelectronic Packages market size is estimated to be worth US$ 1994.2 million in 2022 and is forecast to a readjusted size of US$ 1980.1 million by 2029 with a CAGR of -0.1% during the forecast period 2023-2029. Fully considering the economic change by this health crisis, TO Shell accounting for % of the Metal Shell for Microelectronic Packages global market in 2022, is projected to value US$ million by 2029, growing at a revised % CAGR from 2023 to 2029. While Aeronautics and Astronautics segment is altered to an % CAGR throughout this forecast period.
In terms of market sales, China accounts for 22% of global market share.
In terms of suppliers, the world's leading manufacturers of metal packaging and shell include AMETEK(GSP), SCHOTT, Complete Hermetics, KOTO, Kyocera, SGA Technologies, Century Seals, Kairui, Jiangsu Dongcheng Micro-electronics, Taizhou Hangyu Electric Appliance, CETC40, Bojing Electronics, CETC43, SINOPIONEER, CCTC, Xingchuang, Rizhao Xunsun Electronics and Shengda Technology. The top five together account for 40% of the market.
In the consumer application market, the main application fields are concentrated in aerospace, petrochemical industry, automobile, optical communication and other fields. Among them, optical communication is the largest application field, with more than 31% of the metal shells used for packaging concentrated in optical communication.
Global Metal Shell for Microelectronic Packages Scope and Market Size
The global Metal Shell for Microelectronic Packages market is segmented by company, region (country), type and application. Players, stakeholders, and other participants in the global Metal Shell for Microelectronic Packages market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), type and application for the period 2018-2029.
Segment by Type
TO Shell
Flat Shell
Segment by Application
Aeronautics and Astronautics
Petrochemical Industry
Automobile
Optical Communication
Other
By Region
United States
Europe
China
Japan
Southeast Asia
India
Other Regions
By Company
AMETEK(GSP)
SCHOTT
Complete Hermetics
KOTO
Kyocera
SGA Technologies
Century Seals
KaiRui
Jiangsu Dongguang Micro-electronics
Taizhou Hangyu Electric Appliance
CETC40
BOJING ELECTRONICS
CETC43
SINOPIONEER
CCTC
XingChuang
Rizhao Xuri Electronics Co., Ltd.
ShengDa Technology
Electronic and Semiconductor
Food and Beverages
Chemicals and Materials
Consumer Goods
Construction Manufacturing
Aerospace and Defence
Energy and Power
ICT Media
Banking and Finance
Automotive and Transportation
Machinery and Equipments
Pharmaceutical and Healthcare
Medical Devices