Global Metal Shell for Microelectronic Packages Industry Research Report, Growth Trends and Competitive Analysis 2024-2034
Published on: 2024-01-04 | No of Pages : 400 | Industry : Packaging
Publisher : MRA | Format : PDF
Global Metal Shell for Microelectronic Packages Industry Research Report, Growth Trends and Competitive Analysis 2024-2034
Metal is still the main material of electronic packaging because of its advantages such as good mechanical strength, good thermal conductivity, electromagnetic shielding function and convenient machining. Metal packaging refers to the metal as the main material of the tube shell, directly or indirectly through the substrate to install the chip on the tube seat, with a lead wire connected to the internal and external circuit of an electronic packaging form. It is widely used in the packaging of hybrid circuits, mainly for military, civil and customized special airtight packaging, among which, it has been widely used in the military and aerospace fields. The various forms of metal packaging and flexible processing can be integrated with some components (such as hybrid integrated A/D or D/A converters), suitable for low I/O single chip and multi-chip applications, RF, microwave, optoelectronic, surface acoustic wave and high power devices, can meet the requirements of small batch, high reliability. In addition, in order to solve the problem of packaging heat dissipation, all kinds of packaging also mostly use metal as heat sink and heat sink.
Traditional metal materials includeCu, Al, Kovar alloy (Fe-Ni-Co alloy), Invar alloy (Ni-Fe alloy), W, Mo alloy and so on.
Most metal packages are physical packages. Metal packaging materials in order to achieve the total piece support, electrical connection, heat dissipation, mechanical and environmental protection, usually have the following requirements; ① has good heat conduction and heat dissipation; ② good conductivity, reduce transmission delay and energy loss and sweep; (3) light weight, at the same time requires sufficient strength and mechanical properties; ④ Good processing capacity for mass production; (5) Low thermal expansion coefficient, in order to meet the match with the chip, thereby reducing the generation of thermal stress; Good welding performance, coating performance and corrosion resistance to achieve reliable combination with the chip, sealing and environmental protection.
The global Metal Shell for Microelectronic Packages market size was US$ 1994.2 million in 2022 and is forecast to a readjusted size of US$ 1980.1 million by 2029 with a CAGR of -0.1% during the forecast period 2023-2029.
In terms of market sales, China accounts for 22% of global market share.
In terms of suppliers, the world's leading manufacturers of metal packaging and shell include AMETEK(GSP), SCHOTT, Complete Hermetics, KOTO, Kyocera, SGA Technologies, Century Seals, Kairui, Jiangsu Dongcheng Micro-electronics, Taizhou Hangyu Electric Appliance, CETC40, Bojing Electronics, CETC43, SINOPIONEER, CCTC, Xingchuang, Rizhao Xunsun Electronics and Shengda Technology. The top five together account for 40% of the market.
In the consumer application market, the main application fields are concentrated in aerospace, petrochemical industry, automobile, optical communication and other fields. Among them, optical communication is the largest application field, with more than 31% of the metal shells used for packaging concentrated in optical communication.
In terms of sales (consumption) side, this report focuses on the sales of Metal Shell for Microelectronic Packages by regions (Countries), company, by type and by type. from 2018 to 2023 and forecast to 2029.
The global Metal Shell for Microelectronic Packages market is thoroughly, accurately, and comprehensively assessed in the report with a large focus on market dynamics, market competition, regional growth, segmental analysis, and key growth strategies. Buyers of the report will have access to verified market figures, including global market size in terms of revenue and volume. As part of sales analysis, the authors of the report have provided reliable estimations and calculations for global revenue and sales by type segment of the global Metal Shell for Microelectronic Packages market. These figures have been provided in terms of both revenue and sales for the period 2018-2029. Additionally, the report provides accurate figures for sales by region in terms of revenue as well as volume for the same period.
AMETEK(GSP)
SCHOTT
Complete Hermetics
KOTO
Kyocera
SGA Technologies
Century Seals
KaiRui
Jiangsu Dongguang Micro-electronics
Taizhou Hangyu Electric Appliance
CETC40
BOJING ELECTRONICS
CETC43
SINOPIONEER
CCTC
XingChuang
Rizhao Xuri Electronics Co., Ltd.
ShengDa Technology
By Type
TO Shell
Flat Shell
By Application
Aeronautics and Astronautics
Petrochemical Industry
Automobile
Optical Communication
Other
Sales by Region
North America
United States
Canada
China
APAC (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
Europe
Germany
France
U.K.
Italy
Russia
Middle East, Africa, Latin America
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter 1Introduces the report scope of the report, executive summary of different market segments (by type and by application, etc.), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2Sales (consumption), revenue of Metal Shell for Microelectronic Packages in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 3Detailed analysis of Metal Shell for Microelectronic Packages manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4Provides the analysis of various market segments by type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5Provides the analysis of various market segments by application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6North America by company, by type, by application and by country, sales, and revenue for each segment.
Chapter 7Europe by company, by type, by application and by country, sales, and revenue for each segment.
Chapter 8China by company, by type and by application, sales, and revenue for each segment.
Chapter 9APAC (excluding China) by company, by type, by application and by region, sales, and revenue for each segment.
Chapter 10Middle East, Africa, and Latin America by company, by type, by application and by country, sales, and revenue for each segment.
Chapter 11Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Metal Shell for Microelectronic Packages sales, revenue, price, gross margin, and recent development, etc.
Chapter 12Analysis of industrial chain, sales channel, key raw materials, distributors, and customers.
Chapter 13Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 14The main points and conclusions of the report.
Traditional metal materials includeCu, Al, Kovar alloy (Fe-Ni-Co alloy), Invar alloy (Ni-Fe alloy), W, Mo alloy and so on.
Most metal packages are physical packages. Metal packaging materials in order to achieve the total piece support, electrical connection, heat dissipation, mechanical and environmental protection, usually have the following requirements; ① has good heat conduction and heat dissipation; ② good conductivity, reduce transmission delay and energy loss and sweep; (3) light weight, at the same time requires sufficient strength and mechanical properties; ④ Good processing capacity for mass production; (5) Low thermal expansion coefficient, in order to meet the match with the chip, thereby reducing the generation of thermal stress; Good welding performance, coating performance and corrosion resistance to achieve reliable combination with the chip, sealing and environmental protection.
The global Metal Shell for Microelectronic Packages market size was US$ 1994.2 million in 2022 and is forecast to a readjusted size of US$ 1980.1 million by 2029 with a CAGR of -0.1% during the forecast period 2023-2029.
In terms of market sales, China accounts for 22% of global market share.
In terms of suppliers, the world's leading manufacturers of metal packaging and shell include AMETEK(GSP), SCHOTT, Complete Hermetics, KOTO, Kyocera, SGA Technologies, Century Seals, Kairui, Jiangsu Dongcheng Micro-electronics, Taizhou Hangyu Electric Appliance, CETC40, Bojing Electronics, CETC43, SINOPIONEER, CCTC, Xingchuang, Rizhao Xunsun Electronics and Shengda Technology. The top five together account for 40% of the market.
In the consumer application market, the main application fields are concentrated in aerospace, petrochemical industry, automobile, optical communication and other fields. Among them, optical communication is the largest application field, with more than 31% of the metal shells used for packaging concentrated in optical communication.
In terms of sales (consumption) side, this report focuses on the sales of Metal Shell for Microelectronic Packages by regions (Countries), company, by type and by type. from 2018 to 2023 and forecast to 2029.
The global Metal Shell for Microelectronic Packages market is thoroughly, accurately, and comprehensively assessed in the report with a large focus on market dynamics, market competition, regional growth, segmental analysis, and key growth strategies. Buyers of the report will have access to verified market figures, including global market size in terms of revenue and volume. As part of sales analysis, the authors of the report have provided reliable estimations and calculations for global revenue and sales by type segment of the global Metal Shell for Microelectronic Packages market. These figures have been provided in terms of both revenue and sales for the period 2018-2029. Additionally, the report provides accurate figures for sales by region in terms of revenue as well as volume for the same period.
By Company
AMETEK(GSP)
SCHOTT
Complete Hermetics
KOTO
Kyocera
SGA Technologies
Century Seals
KaiRui
Jiangsu Dongguang Micro-electronics
Taizhou Hangyu Electric Appliance
CETC40
BOJING ELECTRONICS
CETC43
SINOPIONEER
CCTC
XingChuang
Rizhao Xuri Electronics Co., Ltd.
ShengDa Technology
By Type
TO Shell
Flat Shell
By Application
Aeronautics and Astronautics
Petrochemical Industry
Automobile
Optical Communication
Other
Sales by Region
North America
United States
Canada
China
APAC (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
Europe
Germany
France
U.K.
Italy
Russia
Middle East, Africa, Latin America
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1Introduces the report scope of the report, executive summary of different market segments (by type and by application, etc.), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2Sales (consumption), revenue of Metal Shell for Microelectronic Packages in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 3Detailed analysis of Metal Shell for Microelectronic Packages manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4Provides the analysis of various market segments by type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5Provides the analysis of various market segments by application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6North America by company, by type, by application and by country, sales, and revenue for each segment.
Chapter 7Europe by company, by type, by application and by country, sales, and revenue for each segment.
Chapter 8China by company, by type and by application, sales, and revenue for each segment.
Chapter 9APAC (excluding China) by company, by type, by application and by region, sales, and revenue for each segment.
Chapter 10Middle East, Africa, and Latin America by company, by type, by application and by country, sales, and revenue for each segment.
Chapter 11Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Metal Shell for Microelectronic Packages sales, revenue, price, gross margin, and recent development, etc.
Chapter 12Analysis of industrial chain, sales channel, key raw materials, distributors, and customers.
Chapter 13Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 14The main points and conclusions of the report.
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