Global Semiconductor & IC Packaging Market Research Report 2024
Published on: 2024-01-04 | No of Pages : 400 | Industry : Packaging
Publisher : MRA | Format : PDF
Global Semiconductor & IC Packaging Market Research Report 2024
According to MRAResearch’s new survey, global Semiconductor & IC Packaging market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Semiconductor & IC Packaging market research.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Semiconductor & IC Packaging market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
ASE
Amkor
SPIL
STATS ChipPac
Powertech Technology
J-devices
UTAC
JECT
ChipMOS
Chipbond
KYEC
STS Semiconductor
Huatian
MPl(Carsem)
Nepes
FATC
Walton
Kyocera
Unisem
NantongFujitsu Microelectronics
Hana Micron
Walton Advanced Engineering
Signetics
Intel Corp
LINGSEN
Segment by Type
DIP
SOP
QFP
QFN
BGA
CSP
Others
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
The Semiconductor & IC Packaging report covers below items
Chapter 1Product Basic Information (Definition, Type and Application)
Chapter 2Global market size, regional market size. Market Opportunities and Challenges
Chapter 3Companies’ Competition Patterns
Chapter 4Product Type Analysis
Chapter 5Product Application Analysis
Chapter 6 to 10Country Level Value Analysis
Chapter 11Companies' Outline
Chapter 12Market Conclusions
Chapter 13Research Methodology and Data Source
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Semiconductor & IC Packaging market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
ASE
Amkor
SPIL
STATS ChipPac
Powertech Technology
J-devices
UTAC
JECT
ChipMOS
Chipbond
KYEC
STS Semiconductor
Huatian
MPl(Carsem)
Nepes
FATC
Walton
Kyocera
Unisem
NantongFujitsu Microelectronics
Hana Micron
Walton Advanced Engineering
Signetics
Intel Corp
LINGSEN
Segment by Type
DIP
SOP
QFP
QFN
BGA
CSP
Others
Segment by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
The Semiconductor & IC Packaging report covers below items
Chapter 1Product Basic Information (Definition, Type and Application)
Chapter 2Global market size, regional market size. Market Opportunities and Challenges
Chapter 3Companies’ Competition Patterns
Chapter 4Product Type Analysis
Chapter 5Product Application Analysis
Chapter 6 to 10Country Level Value Analysis
Chapter 11Companies' Outline
Chapter 12Market Conclusions
Chapter 13Research Methodology and Data Source