Global ESD Foam Packaging Sales Market Report 2024
Published on: 2024-01-04 | No of Pages : 400 | Industry : Packaging
Publisher : MRA | Format : PDF
Global ESD Foam Packaging Sales Market Report 2024
Market Analysis and InsightsGlobal ESD Foam Packaging Market
Higher dimensional stability of ESD foam compared to other packaging materials for electronic equipment could be a key marker for the rising demand in the global ESD foam packaging market. Furthermore, the ability of ESD foam to be cut into any shape to seamlessly sync with that of electronic equipment is foreseen to be another factor driving the growth of the market.
Due to the COVID-19 pandemic, the global ESD Foam Packaging market size is estimated to be worth US$ 157.9 million in 2022 and is forecast to a readjusted size of US$ 208.2 million by 2029 with a CAGR of 3.6% during the forecast period 2023-2029. Fully considering the economic change by this health crisis, Conductive and Dissipative Polymer accounting for % of the ESD Foam Packaging global market in 2022, is projected to value US$ million by 2029, growing at a revised % CAGR from 2023 to 2029. While Electrical and Electronics segment is altered to an % CAGR throughout this forecast period.
The United States ESD Foam Packaging market is estimated at US$ million in 2022, while China was US$ million. The proportion of the United States is % in 2022, while Chinese percentage was %, and it is predicted that China share will reach % in 2029, trailing a CAGR of % through the analysis period.
The global key manufacturers of ESD Foam Packaging include Nefab, Tekins, Elcom, GWP Group, Botron, Conductive Containers, Helios, Electrotek and Statclean, etc. In 2022, the global top five players occupied for a share approximately % in terms of revenue.
In United States, in terms of sales revenue, in 2022, the top three players hold a share about %, while in China, top three players hold a share nearly %.
Global ESD Foam Packaging Scope and Market Size
The global ESD Foam Packaging market is segmented by company, region (country), type and application. Players, stakeholders, and other participants in the global ESD Foam Packaging market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), type and application for the period 2018-2029.
Segment by Type
Conductive and Dissipative Polymer
Metal
Additive
Electrical and Electronics
Automobile
Defense and Military
Manufacturing
Aerospace
Others
By Region
United States
Europe
China
Japan
Southeast Asia
India
Other Regions
![](http//localhost/mraccuracy/images/Market%20Recearch%20Graph.jpg)
Nefab
Tekins
Elcom
GWP Group
Botron
Conductive Containers
Helios
Electrotek
Statclean![](http://localhost/mraccuracy/images/About Report.webp)
Higher dimensional stability of ESD foam compared to other packaging materials for electronic equipment could be a key marker for the rising demand in the global ESD foam packaging market. Furthermore, the ability of ESD foam to be cut into any shape to seamlessly sync with that of electronic equipment is foreseen to be another factor driving the growth of the market.
Due to the COVID-19 pandemic, the global ESD Foam Packaging market size is estimated to be worth US$ 157.9 million in 2022 and is forecast to a readjusted size of US$ 208.2 million by 2029 with a CAGR of 3.6% during the forecast period 2023-2029. Fully considering the economic change by this health crisis, Conductive and Dissipative Polymer accounting for % of the ESD Foam Packaging global market in 2022, is projected to value US$ million by 2029, growing at a revised % CAGR from 2023 to 2029. While Electrical and Electronics segment is altered to an % CAGR throughout this forecast period.
The United States ESD Foam Packaging market is estimated at US$ million in 2022, while China was US$ million. The proportion of the United States is % in 2022, while Chinese percentage was %, and it is predicted that China share will reach % in 2029, trailing a CAGR of % through the analysis period.
The global key manufacturers of ESD Foam Packaging include Nefab, Tekins, Elcom, GWP Group, Botron, Conductive Containers, Helios, Electrotek and Statclean, etc. In 2022, the global top five players occupied for a share approximately % in terms of revenue.
In United States, in terms of sales revenue, in 2022, the top three players hold a share about %, while in China, top three players hold a share nearly %.
Global ESD Foam Packaging Scope and Market Size
The global ESD Foam Packaging market is segmented by company, region (country), type and application. Players, stakeholders, and other participants in the global ESD Foam Packaging market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), type and application for the period 2018-2029.
Segment by Type
Conductive and Dissipative Polymer
Metal
Additive
Segment by Application
Electrical and Electronics
Automobile
Defense and Military
Manufacturing
Aerospace
Others
By Region
United States
Europe
China
Japan
Southeast Asia
India
Other Regions
![](http//localhost/mraccuracy/images/Market%20Recearch%20Graph.jpg)
By Company
Nefab
Tekins
Elcom
GWP Group
Botron
Conductive Containers
Helios
Electrotek
Statclean
![](http://localhost/mraccuracy/images/About Report.webp)