Silicon-on-Insulator (SOI)
Published on: 2024-01-04 | No of Pages : 144 | Industry : Electronics & Semiconductor
Publisher : HNY Research | Format : PDF&Excel
Silicon-on-Insulator (SOI)
The global Silicon-on-Insulator (SOI) market was valued at 741.02 Million USD in 2021 and will grow with a CAGR of 18.25% from 2021 to 2027, based on HNY Research newly published report.
The prime objective of this report is to provide the insights on the post COVID-19 impact wwhich will help market players in this field evaluate their business approaches. Also, this report covers market segmentation by major market verdors, types, applications/end users and geography(North America, East Asia, Europe, South Asia, Southeast Asia, Middle East, Africa, Oceania, South America).
Silicon-On-Insulator (SOI) is a semiconductor fabrication technique developed by IBM that uses pure crystal silicon and silicon oxide for integrated circuits (ICs) and microchips. An SOI microchip processing speed is often 30% faster than today`s complementary metal-oxide semiconductor (CMOS)-based chips and power consumption is reduced 80%, which makes them ideal for mobile devices. SOI chips also reduce the soft error rate, which is data corruption caused by cosmic rays and natural radioactive background signals.SOI, as the name suggests, consists of a top thin layer of silicon and a bottom thick layer of silicon. An insulator material such as silicon dioxide (SiO2) is placed between these two layers. SOI offers high performance, low power consumption, and high speed compared to traditional silicon wafers. All these factors make it an ideal choice for portable applications such as mobile phones, portable digital assistants (PDAs), notebooks, digital cameras, and others. These wafers were developed in the 1960s for defense and military applications, and the commercialization of these wafers took place gradually The growth of this market is propelled by the growth in the consumer electronics market, low wafer and gate cost, low operating voltage, and miniaturization of semiconductor devices. Based on diameters, 200 mm SOI wafers held the largest share of the SOI market in 2017. The market for these wafers is expected to grow at a high rate between 2017 and 2025. 200 mm wafers are mainly used for manufacturing RFSOI wafers, which are further used in smartphones for manufacturing antenna switches and other important components. Currently, virtually all the RF chips, including 2G, 3G, and 4G, are manufactured by using 200 mm SOI wafers. The improvement will be primarily driven by the growth in sales volumes for 300 mm wafers and by controlling production costs on the small diameter line that is running at full capacity. The loading rate of the 300 mm production lines improved significantly, but still remains globally low. BESOI, ELTRAN, SoS, SiMOX and smart cut are the technology segment of the market. Smart cut technology accounted for the largest share of the SOI market in 2017. Soitec (France) developed the smart cut technology in collaboration with CEA-Leti (microelectronics research lab). The licensing of Soitec`s Smartcut™ technology to other companies is anticipated to further increase the SOI wafer supply. Soitec, the world`s leading provider of SOI wafers, has been pioneering the SOI technology. This accounted for more than 69% of the revenues of the world SOI wafers market in 2017. The other key participants in the SOI wafer market are SunEdison (acquired by Globalwafers Co.,. in 2016), Shin-Etsu Handotai Co.. and a few others like SUMCO , Ultrasil and etc. Manufacturer are focusing on strategies such as new product launches, expansions, contracts, and collaborations to enhance their product offerings and expand their business. The computing and mobile segment accounted for the largest share of the overall SOI market in 2017. Power consumption is one of the burning issues faced by the consumer electronics segment. There are various issues associated with the conventional bulk CMOS technology, such as slow processing speed, high power consumption, low battery life, and soft errors such as data loss caused due to cosmic rays and natural radioactive background signals. The SOI microchip overcomes all these issues and improves the processing speed and performance by up to 30% compared with the CMOS-based chips; it also reduces the power consumption by up to 80%. These features make it ideal for use in computers and cell phones. Asia-Pacific is predicted to witness the fastest growth over the forecast period owing developing integrated circuit industry. The leading players are emphasizing on modernizing their plants in APAC and fab facilities with advanced technologies. The countries such as China (Taiwan included) and Japan have the largest semiconductor manufacturing base, which is further helping the SOI market grow in this region. The increase in production facilities, rising demand for consumer electronics products, and continuous upgradation and improved efficiency of fab facilities are the key factors driving the growth of the SOI market in APAC. The key factors restraining the growth of the SOI market are the lack of available IP ecosystem and the floating body effect. The floating body effect is one of the major drawbacks of the SOI devices. It is the dependence of body potential on the history of biasing.
By Market Verdors
Soitec SA
Shin-Etsu Chemical
SunEdison
By Types
300 mm SOI
Small Diameters
By Applications
Automobile and Smart Industry
Consumer Electronic
Key Indicators Analysed
Market Players & Competitor AnalysisThe report covers the key players of the industry including Company Profile, Product Specifications, Production Capacity/Sales, Revenue, Price and Gross Margin 2016-2027 & Sales with a thorough analysis of the market’s competitive landscape and detailed information on vendors and comprehensive details of factors that will challenge the growth of major market vendors.
Global and Regional Market AnalysisThe report includes Global & Regional market status and outlook 2016-2027. Further the report provides break down details about each region & countries covered in the report. Identifying its sales, sales volume & revenue forecast. With detailed analysis by types and applications.
Market TrendsMarket key trends which include Increased Competition and Continuous Innovations.
Opportunities and DriversIdentifying the Growing Demands and New Technology
Porters Five Force AnalysisThe report provides with the state of competition in industry depending on five basic forcesthreat of new entrants, bargaining power of suppliers, bargaining power of buyers, threat of substitute products or services, and existing industry rivalry.
Key Reasons to Purchase
To gain insightful analyses of the market and have comprehensive understanding of the global market and its commercial landscape.
Assess the production processes, major issues, and solutions to mitigate the development risk.
To understand the most affecting driving and restraining forces in the market and its impact in the global market.
Learn about the market strategies that are being adopted by leading respective organizations.
To understand the future outlook and prospects for the market.
Besides the standard structure reports, we also provide custom research according to specific requirements
The prime objective of this report is to provide the insights on the post COVID-19 impact wwhich will help market players in this field evaluate their business approaches. Also, this report covers market segmentation by major market verdors, types, applications/end users and geography(North America, East Asia, Europe, South Asia, Southeast Asia, Middle East, Africa, Oceania, South America).
Silicon-On-Insulator (SOI) is a semiconductor fabrication technique developed by IBM that uses pure crystal silicon and silicon oxide for integrated circuits (ICs) and microchips. An SOI microchip processing speed is often 30% faster than today`s complementary metal-oxide semiconductor (CMOS)-based chips and power consumption is reduced 80%, which makes them ideal for mobile devices. SOI chips also reduce the soft error rate, which is data corruption caused by cosmic rays and natural radioactive background signals.SOI, as the name suggests, consists of a top thin layer of silicon and a bottom thick layer of silicon. An insulator material such as silicon dioxide (SiO2) is placed between these two layers. SOI offers high performance, low power consumption, and high speed compared to traditional silicon wafers. All these factors make it an ideal choice for portable applications such as mobile phones, portable digital assistants (PDAs), notebooks, digital cameras, and others. These wafers were developed in the 1960s for defense and military applications, and the commercialization of these wafers took place gradually The growth of this market is propelled by the growth in the consumer electronics market, low wafer and gate cost, low operating voltage, and miniaturization of semiconductor devices. Based on diameters, 200 mm SOI wafers held the largest share of the SOI market in 2017. The market for these wafers is expected to grow at a high rate between 2017 and 2025. 200 mm wafers are mainly used for manufacturing RFSOI wafers, which are further used in smartphones for manufacturing antenna switches and other important components. Currently, virtually all the RF chips, including 2G, 3G, and 4G, are manufactured by using 200 mm SOI wafers. The improvement will be primarily driven by the growth in sales volumes for 300 mm wafers and by controlling production costs on the small diameter line that is running at full capacity. The loading rate of the 300 mm production lines improved significantly, but still remains globally low. BESOI, ELTRAN, SoS, SiMOX and smart cut are the technology segment of the market. Smart cut technology accounted for the largest share of the SOI market in 2017. Soitec (France) developed the smart cut technology in collaboration with CEA-Leti (microelectronics research lab). The licensing of Soitec`s Smartcut™ technology to other companies is anticipated to further increase the SOI wafer supply. Soitec, the world`s leading provider of SOI wafers, has been pioneering the SOI technology. This accounted for more than 69% of the revenues of the world SOI wafers market in 2017. The other key participants in the SOI wafer market are SunEdison (acquired by Globalwafers Co.,. in 2016), Shin-Etsu Handotai Co.. and a few others like SUMCO , Ultrasil and etc. Manufacturer are focusing on strategies such as new product launches, expansions, contracts, and collaborations to enhance their product offerings and expand their business. The computing and mobile segment accounted for the largest share of the overall SOI market in 2017. Power consumption is one of the burning issues faced by the consumer electronics segment. There are various issues associated with the conventional bulk CMOS technology, such as slow processing speed, high power consumption, low battery life, and soft errors such as data loss caused due to cosmic rays and natural radioactive background signals. The SOI microchip overcomes all these issues and improves the processing speed and performance by up to 30% compared with the CMOS-based chips; it also reduces the power consumption by up to 80%. These features make it ideal for use in computers and cell phones. Asia-Pacific is predicted to witness the fastest growth over the forecast period owing developing integrated circuit industry. The leading players are emphasizing on modernizing their plants in APAC and fab facilities with advanced technologies. The countries such as China (Taiwan included) and Japan have the largest semiconductor manufacturing base, which is further helping the SOI market grow in this region. The increase in production facilities, rising demand for consumer electronics products, and continuous upgradation and improved efficiency of fab facilities are the key factors driving the growth of the SOI market in APAC. The key factors restraining the growth of the SOI market are the lack of available IP ecosystem and the floating body effect. The floating body effect is one of the major drawbacks of the SOI devices. It is the dependence of body potential on the history of biasing.
By Market Verdors
Soitec SA
Shin-Etsu Chemical
SunEdison
By Types
300 mm SOI
Small Diameters
By Applications
Automobile and Smart Industry
Consumer Electronic
Key Indicators Analysed
Market Players & Competitor AnalysisThe report covers the key players of the industry including Company Profile, Product Specifications, Production Capacity/Sales, Revenue, Price and Gross Margin 2016-2027 & Sales with a thorough analysis of the market’s competitive landscape and detailed information on vendors and comprehensive details of factors that will challenge the growth of major market vendors.
Global and Regional Market AnalysisThe report includes Global & Regional market status and outlook 2016-2027. Further the report provides break down details about each region & countries covered in the report. Identifying its sales, sales volume & revenue forecast. With detailed analysis by types and applications.
Market TrendsMarket key trends which include Increased Competition and Continuous Innovations.
Opportunities and DriversIdentifying the Growing Demands and New Technology
Porters Five Force AnalysisThe report provides with the state of competition in industry depending on five basic forcesthreat of new entrants, bargaining power of suppliers, bargaining power of buyers, threat of substitute products or services, and existing industry rivalry.
Key Reasons to Purchase
To gain insightful analyses of the market and have comprehensive understanding of the global market and its commercial landscape.
Assess the production processes, major issues, and solutions to mitigate the development risk.
To understand the most affecting driving and restraining forces in the market and its impact in the global market.
Learn about the market strategies that are being adopted by leading respective organizations.
To understand the future outlook and prospects for the market.
Besides the standard structure reports, we also provide custom research according to specific requirements
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