Silicon on Insulator
Published on: 2024-01-04 | No of Pages : 120 | Industry : Electronics & Semiconductor
Publisher : HNY Research | Format : PDF&Excel
Silicon on Insulator
The global Silicon on Insulator market was valued at 749.37 Million USD in 2021 and will grow with a CAGR of 11.64% from 2021 to 2027, based on HNY Research newly published report.
The prime objective of this report is to provide the insights on the post COVID-19 impact wwhich will help market players in this field evaluate their business approaches. Also, this report covers market segmentation by major market verdors, types, applications/end users and geography(North America, East Asia, Europe, South Asia, Southeast Asia, Middle East, Africa, Oceania, South America).
This report studies the Silicon on Insulator (SOI) market. Silicon on Insulator (SOI) is a semiconductor fabrication technique developed by IBM that uses pure crystal silicon and silicon oxide for integrated circuits (ICs) and microchips. An SOI microchip processing speed is often 30% faster than today`s complementary metal-oxide semiconductor (CMOS)-based chips and power consumption is reduced 80%, which makes them ideal for mobile devices. SOI chips also reduce the soft error rate, which is data corruption caused by cosmic rays and natural radioactive background signals.Silicon on Insulator (SOI) is a new type of starting material for the chipmaking process. SOI wafers have three layers; a thin surface layer of silicon (from a few hundred Angstrom to several microns thick) where the transistors are formed, an underlying layer of insulating material on a support or "handle" bulk silicon wafer. The insulating layer, usually made of silicon dioxide, is referred to as the "buried oxide" or "BOX", and is usually a few thousand Angstroms thick. Transistors built within the top silicon layer, switch signals faster, run at lower voltages, and are much less vulnerable to signal noise from background cosmic ray particles. Each transistor is isolated from its neighbor by a complete layer of silicon dioxide. These transistors are immune to "latch-up" problems and can be spaced closer together than transistors built on bulk silicon wafers. Building circuits on SOI increases Fab productivity by allowing for more compact circuit designs, yielding more chips per wafer. SOI enables increased chip functionality without the cost of major Fab process equipment changes. Faster circuit operation and lower operating voltages have produced a powerful surge in the performance of high-speed network servers and new designs for hand-held computing and communication devices with longer battery life. Advanced circuits, using multiple layers of SOI-type device silicon, can lead the way to a coupling of electrical and optical signal processing into a single chip resulting in a dramatic broadening of communication bandwidth and new applications such as global-ranging, direct-link entertainment and communication to hand-held devices. The market in APAC is expected to grow at the highest CAGR during 2018-2023. APAC is witnessing an increase in the use of SOI products owing to the presence of a large number of consumer electronic companies, smartphone manufacturers, and wafer and foundry players in APAC.
By Market Verdors
Soitec SA
Shin-Etsu Chemical
SunEdison
By Types
300mm SOI
Small Diameters
By Applications
Automobile and Smart Industry
Consumer Electronic
Key Indicators Analysed
Market Players & Competitor AnalysisThe report covers the key players of the industry including Company Profile, Product Specifications, Production Capacity/Sales, Revenue, Price and Gross Margin 2016-2027 & Sales with a thorough analysis of the market’s competitive landscape and detailed information on vendors and comprehensive details of factors that will challenge the growth of major market vendors.
Global and Regional Market AnalysisThe report includes Global & Regional market status and outlook 2016-2027. Further the report provides break down details about each region & countries covered in the report. Identifying its sales, sales volume & revenue forecast. With detailed analysis by types and applications.
Market TrendsMarket key trends which include Increased Competition and Continuous Innovations.
Opportunities and DriversIdentifying the Growing Demands and New Technology
Porters Five Force AnalysisThe report provides with the state of competition in industry depending on five basic forcesthreat of new entrants, bargaining power of suppliers, bargaining power of buyers, threat of substitute products or services, and existing industry rivalry.
Key Reasons to Purchase
To gain insightful analyses of the market and have comprehensive understanding of the global market and its commercial landscape.
Assess the production processes, major issues, and solutions to mitigate the development risk.
To understand the most affecting driving and restraining forces in the market and its impact in the global market.
Learn about the market strategies that are being adopted by leading respective organizations.
To understand the future outlook and prospects for the market.
Besides the standard structure reports, we also provide custom research according to specific requirements
The prime objective of this report is to provide the insights on the post COVID-19 impact wwhich will help market players in this field evaluate their business approaches. Also, this report covers market segmentation by major market verdors, types, applications/end users and geography(North America, East Asia, Europe, South Asia, Southeast Asia, Middle East, Africa, Oceania, South America).
This report studies the Silicon on Insulator (SOI) market. Silicon on Insulator (SOI) is a semiconductor fabrication technique developed by IBM that uses pure crystal silicon and silicon oxide for integrated circuits (ICs) and microchips. An SOI microchip processing speed is often 30% faster than today`s complementary metal-oxide semiconductor (CMOS)-based chips and power consumption is reduced 80%, which makes them ideal for mobile devices. SOI chips also reduce the soft error rate, which is data corruption caused by cosmic rays and natural radioactive background signals.Silicon on Insulator (SOI) is a new type of starting material for the chipmaking process. SOI wafers have three layers; a thin surface layer of silicon (from a few hundred Angstrom to several microns thick) where the transistors are formed, an underlying layer of insulating material on a support or "handle" bulk silicon wafer. The insulating layer, usually made of silicon dioxide, is referred to as the "buried oxide" or "BOX", and is usually a few thousand Angstroms thick. Transistors built within the top silicon layer, switch signals faster, run at lower voltages, and are much less vulnerable to signal noise from background cosmic ray particles. Each transistor is isolated from its neighbor by a complete layer of silicon dioxide. These transistors are immune to "latch-up" problems and can be spaced closer together than transistors built on bulk silicon wafers. Building circuits on SOI increases Fab productivity by allowing for more compact circuit designs, yielding more chips per wafer. SOI enables increased chip functionality without the cost of major Fab process equipment changes. Faster circuit operation and lower operating voltages have produced a powerful surge in the performance of high-speed network servers and new designs for hand-held computing and communication devices with longer battery life. Advanced circuits, using multiple layers of SOI-type device silicon, can lead the way to a coupling of electrical and optical signal processing into a single chip resulting in a dramatic broadening of communication bandwidth and new applications such as global-ranging, direct-link entertainment and communication to hand-held devices. The market in APAC is expected to grow at the highest CAGR during 2018-2023. APAC is witnessing an increase in the use of SOI products owing to the presence of a large number of consumer electronic companies, smartphone manufacturers, and wafer and foundry players in APAC.
By Market Verdors
Soitec SA
Shin-Etsu Chemical
SunEdison
By Types
300mm SOI
Small Diameters
By Applications
Automobile and Smart Industry
Consumer Electronic
Key Indicators Analysed
Market Players & Competitor AnalysisThe report covers the key players of the industry including Company Profile, Product Specifications, Production Capacity/Sales, Revenue, Price and Gross Margin 2016-2027 & Sales with a thorough analysis of the market’s competitive landscape and detailed information on vendors and comprehensive details of factors that will challenge the growth of major market vendors.
Global and Regional Market AnalysisThe report includes Global & Regional market status and outlook 2016-2027. Further the report provides break down details about each region & countries covered in the report. Identifying its sales, sales volume & revenue forecast. With detailed analysis by types and applications.
Market TrendsMarket key trends which include Increased Competition and Continuous Innovations.
Opportunities and DriversIdentifying the Growing Demands and New Technology
Porters Five Force AnalysisThe report provides with the state of competition in industry depending on five basic forcesthreat of new entrants, bargaining power of suppliers, bargaining power of buyers, threat of substitute products or services, and existing industry rivalry.
Key Reasons to Purchase
To gain insightful analyses of the market and have comprehensive understanding of the global market and its commercial landscape.
Assess the production processes, major issues, and solutions to mitigate the development risk.
To understand the most affecting driving and restraining forces in the market and its impact in the global market.
Learn about the market strategies that are being adopted by leading respective organizations.
To understand the future outlook and prospects for the market.
Besides the standard structure reports, we also provide custom research according to specific requirements
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