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Global Fan-out Wafer Level Package Industry Outlook 2024: Overview, Opportunities, Key Companies and Forecast to 2034

Published on: 2024-01-04 | No of Pages : 411 | Industry : Electronics & Semiconductor

Publisher : GRD Survey | Format : PDF

Global Fan-out Wafer Level Package Industry Outlook 2024: Overview, Opportunities, Key Companies and Forecast to 2034

Executive Summary

According to GRD Survey data, the global Fan-out Wafer Level Package market is estimated at million US$ in 2021 and is expected to reach million US$ by the end of 2028, growing at a CAGR of % in the forecast period between 2022 and 2028.

This report studies the Fan-out Wafer Level Package market dynamics from angles such as new entries, mergers and acquisitions, fundings, exit and major technology breakthroughs. Market performance is evaluated through market size (value and volume) by players, regions, product types and end industries. This report also studies the global market competition landscape, market drivers and trends, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.

Geographically, this report is segmented into several key regions, with sales, revenue, market share and growth Rate of Fan-out Wafer Level Package in these regions, from 2016 to 2027, covering
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Italy, Spain and Russia, etc.)
Asia-Pacific (China, Japan, Korea, Southeast Asia, India, Australia)
South America (Brazil, Argentina, Colombia, etc.)
Middle East and Africa (Turkey, Saudi Arabia, South Africa, etc.)

Market Snapshot, By Product Type
200mm Wafers
300mm Wafers
450mm Wafers
Others

Market Snapshot, By Application
Electronics & Semiconductor
Communication Engineering
Others

Main Market Players Analyzed in this report, including
ASE
TSMC
Taiwan Semiconductor Manufacturing
Stats ChipPAC
Spil
Nepes
NANIUM
JCAP
Infineon
Huatian Technology
Freescale
Deca Technology
Amkor Technology

The study objectives of this report are
To study and analyze the global Fan-out Wafer Level Package market size (value & volume) by company, key regions/countries, products and application, history data from 2016 to 2020, and forecast to 2027.
To understand industry structure of Fan-out Wafer Level Package market by identifying its various subsegments.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To identify the key global Fan-out Wafer Level Package manufacturers and regional typical players, to define, describe and analyze their sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the Fan-out Wafer Level Package market with respect to individual growth trends, future prospects, and their contribution to the total market.
To project the value and volume of Fan-out Wafer Level Package submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.

In this study, the years considered to estimate the market size of Fan-out Wafer Level Package are as follows
History Year2016-2020
Base Year2020
Estimated Year2021
Forecast Year 2021 to 2027

This report includes the estimation of market size in terms of value (million USD) and volume from top-down approach by analyzing major submarkets and their major driving factors, and verified from bottom-up approaches. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified from primary sources.

For the data information by region, company, type and application, 2020 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

Key Stakeholders Considered in the study
Raw material vendors
Distributors/traders/wholesalers/suppliers
Regulatory authorities, including government agencies and NGO
Commercial research & development (R&D) institutions
Importers and exporters
Government organizations, research organizations, and consulting firms
Trade/Industrial associations
End-use industries

Table of Content

Global Fan-out Wafer Level Package Industry Outlook 2022: Overview, Opportunities, Key Companies and Forecast to 2028.pdf

List of Figure

Table of Contents

1 Market Definition & Scope
1.1 Definition & Scope
1.2 Fan-out Wafer Level Package Product Specifications
1.3 Main Events (Entry, M&A, Exit, Technology and Capital Activity)
1.4 Global Fan-out Wafer Level Package Market Performance and Outlook

2 Market Development Performance under COVID-19
2.1 Influencing Factors of Industry Development in the Next Five Years
2.1.1 Drivers
2.1.2 Restraints
2.1.3 Opportunities
2.2 Porter’s Five Forces Analysis
2.3 Comparison of Alternatives and Fan-out Wafer Level Package

3 Supply Chain and Manufacturing Cost Analysis
3.1 Supply Chain Analysis
3.2 Raw Materials and Key Suppliers Analysis
3.2.1 Raw Materials Introduction
3.2.1 Raw Materials Key Suppliers List
3.3 Fan-out Wafer Level Package Sales Channel and Distributors Analysis
3.3.1 Fan-out Wafer Level Package Sales Channel
3.3.2 Fan-out Wafer Level Package Distributors
3.4 Key Buying Industries/Consumers
3.4.1 Major Buyers in Electronics & Semiconductor
3.4.2 Major Buyers in Communication Engineering
3.5 Fan-out Wafer Level Package Manufacturing Cost Structure Analysis

4 Market Segment: by Type
4.1 Fan-out Wafer Level Package Type Introduction
4.1.1 200mm Wafers
4.1.2 300mm Wafers
4.1.3 450mm Wafers
4.1.4 Others
4.2 Global Fan-out Wafer Level Package Sales by Type 2016-2021
4.3 Global Fan-out Wafer Level Package Revenue by Type 2016-2021
4.4 Global Fan-out Wafer Level Package Price by Type 2016-2021

5 Market Segment: by Application
5.1 Fan-out Wafer Level Package Type Introduction
5.1.1 Electronics & Semiconductor
5.1.2 Communication Engineering
5.1.3 Others
5.2 Global Fan-out Wafer Level Package Sales by Application 2016-2021
5.3 Global Fan-out Wafer Level Package Revenue by Application 2016-2021
5.4 Global Fan-out Wafer Level Package Price by Application 2016-2021

6 Marke Segment: by Region
6.1 Global Fan-out Wafer Level Package Market by Region
6.1.1 Global Fan-out Wafer Level Package Sales by Regions
6.1.2 Global Fan-out Wafer Level Package Revenue by Regions
6.2 North America Fan-out Wafer Level Package Market 2016-2021
6.3 Europe Fan-out Wafer Level Package Market 2016-2021
6.4 Asia Pacific Fan-out Wafer Level Package Market 2016-2021
6.5 South America Fan-out Wafer Level Package Market 2016-2021
6.6 Middle East and Africa Fan-out Wafer Level Package Market 2016-2021

7 North America
7.1 North America Fan-out Wafer Level Package Market by Country 2016-2021
7.1.1 North America Fan-out Wafer Level Package Sales by Country
7.1.2 North America Fan-out Wafer Level Package Revenue by Country
7.2 United States
7.3 Canada
7.4 Mexico

8 Europe
8.1 Europe Fan-out Wafer Level Package Market by Country 2016-2021
8.1.1 Europe Fan-out Wafer Level Package Sales by Country
8.1.2 Europe Fan-out Wafer Level Package Revenue by Country
8.2 Germany
8.3 France
8.4 UK
8.5 Italy
8.6 Russia
8.7 Spain

9 Asia Pacific
9.1 Asia Pacific Fan-out Wafer Level Package Market by Country 2016-2021
9.1.1 Asia Pacific Fan-out Wafer Level Package Sales by Country
9.1.2 Asia Pacific Fan-out Wafer Level Package Revenue by Country
9.2 China
9.3 Japan
9.4 Korea
9.5 Southeast Asia
9.6 India
9.7 Australia

10 South America
10.1 South America Fan-out Wafer Level Package Market by Country 2016-2021
10.1.1 South America Fan-out Wafer Level Package Sales by Country
10.1.2 South America Fan-out Wafer Level Package Revenue by Country
10.2 Brazil
10.3 Argentina
10.4 Colombia

11 Middle East and Africa
11.1 Middle East and Africa Fan-out Wafer Level Package Market by Country 2016-2021
11.1.1 Middle East and Africa Fan-out Wafer Level Package Sales by Country
11.1.2 Middle East and Africa Fan-out Wafer Level Package Revenue by Country
11.2 Turkey
11.3 Saudi Arabia
11.4 South Africa

12 Key Participants Company Information
12.1 ASE
12.1.1 ASE Company Information
12.1.2 ASE Fan-out Wafer Level Package Product Portfolio, Specification and Application
12.1.3 ASE Fan-out Wafer Level Package Sales, Price, Revenue and Gross Margin (2019-2021)
12.1.4 ASE Key Development
12.2 TSMC
12.2.1 TSMC Company Information
12.2.2 TSMC Fan-out Wafer Level Package Product Portfolio, Specification and Application
12.2.3 TSMC Fan-out Wafer Level Package Sales, Price, Revenue and Gross Margin (2019-2021)
12.2.4 TSMC Key Development
12.3 Taiwan Semiconductor Manufacturing
12.3.1 Taiwan Semiconductor Manufacturing Company Information
12.3.2 Taiwan Semiconductor Manufacturing Fan-out Wafer Level Package Product Portfolio, Specification and Application
12.3.3 Taiwan Semiconductor Manufacturing Fan-out Wafer Level Package Sales, Price, Revenue and Gross Margin (2019-2021)
12.3.4 Taiwan Semiconductor Manufacturing Key Development
12.4 Stats ChipPAC
12.4.1 Stats ChipPAC Company Information
12.4.2 Stats ChipPAC Fan-out Wafer Level Package Product Portfolio, Specification and Application
12.4.3 Stats ChipPAC Fan-out Wafer Level Package Sales, Price, Revenue and Gross Margin (2019-2021)
12.4.4 Stats ChipPAC Key Development
12.5 Spil
12.5.1 Spil Company Information
12.5.2 Spil Fan-out Wafer Level Package Product Portfolio, Specification and Application
12.5.3 Spil Fan-out Wafer Level Package Sales, Price, Revenue and Gross Margin (2019-2021)
12.5.4 Spil Key Development
12.6 Nepes
12.6.1 Nepes Company Information
12.6.2 Nepes Fan-out Wafer Level Package Product Portfolio, Specification and Application
12.6.3 Nepes Fan-out Wafer Level Package Sales, Price, Revenue and Gross Margin (2019-2021)
12.6.4 Nepes Key Development
12.7 NANIUM
12.7.1 NANIUM Company Information
12.7.2 NANIUM Fan-out Wafer Level Package Product Portfolio, Specification and Application
12.7.3 NANIUM Fan-out Wafer Level Package Sales, Price, Revenue and Gross Margin (2019-2021)
12.7.4 Nepes Key Development
12.9 Infineon
12.9.1 Infineon Company Information
12.9.2 Infineon Fan-out Wafer Level Package Product Portfolio, Specification and Application
12.9.3 Infineon Fan-out Wafer Level Package Sales, Price, Revenue and Gross Margin (2019-2021)
12.9.4 Infineon Key Development
12.8 JCAP
12.8.1 JCAP Company Information
12.8.2 JCAP Fan-out Wafer Level Package Product Portfolio, Specification and Application
12.8.3 JCAP Fan-out Wafer Level Package Sales, Price, Revenue and Gross Margin (2019-2021)
12.8.4 JCAP Key Development
12.11 Freescale
12.11.1 Freescale Company Information
12.11.2 Freescale Fan-out Wafer Level Package Product Portfolio, Specification and Application
12.11.3 Freescale Fan-out Wafer Level Package Sales, Price, Revenue and Gross Margin (2019-2021)
12.11.4 Freescale Key Development
12.12 Deca Technology
12.12.1 Deca Technology Company Information
12.12.2 Deca Technology Fan-out Wafer Level Package Product Portfolio, Specification and Application
12.12.3 Deca Technology Fan-out Wafer Level Package Sales, Price, Revenue and Gross Margin (2019-2021)
12.12.4 Deca Technology Key Development
12.13 Amkor Technology
12.13.1 Amkor Technology Company Information
12.13.2 Amkor Technology Fan-out Wafer Level Package Product Portfolio, Specification and Application
12.13.3 Amkor Technology Fan-out Wafer Level Package Sales, Price, Revenue and Gross Margin (2019-2021)
12.13.4 Amkor Technology Key Development

13 Global Fan-out Wafer Level Package Market Forecast by Region by Type and by Application
13.1 Global Fan-out Wafer Level Package Sales, Revenue Forecast 2022-2027
13.2 Global Fan-out Wafer Level Package Forecast by Regions
13.2.1 Global Fan-out Wafer Level Package Sales Forecast by Region 2022-2027
13.2.2 Global Fan-out Wafer Level Package Revenue Forecast by Region 2022-2027
13.3 Global Fan-out Wafer Level Package Forecast by Type
13.3.1 Global Fan-out Wafer Level Package Sales Forecast by Type 2022-2027
13.3.2 Global Fan-out Wafer Level Package Revenue Forecast by Type 2022-2027
13.3.3 Global Fan-out Wafer Level Package Price Forecast by Type 2022-2027
13.4 Global Fan-out Wafer Level Package Forecast by Application
13.4.1 Global Fan-out Wafer Level Package Sales Forecast by Application 2022-2027
13.4.2 Global Fan-out Wafer Level Package Revenue Forecast by Application 2022-2027
13.4.3 Global Fan-out Wafer Level Package Price Forecast by Application 2022-2027

14 Analyst Views and Conclusions

15 Methodology and Data Source
15.1 Methodology
15.2 Research Data Source
15.2.1 Secondary Data
15.2.2 Primary Data
15.2.3 Market Size Estimation
15.3 Legal Disclaimer

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